Production Platform
  • Single Process Module:

Apollo Stripper

The Apollo is a compat, inexpensive and versatile stripping system, which has the following features:

    • Etch rates up to 6um/min
    • High throughput
    • Low plasma damage
    • Self-tuning
    • 100mm to 300mm wafers
    • Small footprint
    • Competitively priced

Applications

MEMS, Compound Semiconductor, Pilot Line Production.

 

alt Brochure - Apollo Stripper

 


 

 

Titan Loadlocked RIE or PECVD with Vacuum Cassette Elevator

A very compact, fully automated, vacuum loadlocked plasma system for semi-conductor production. Available in either Reactive Ion Etch (RIE) configuration, High Density Inductive Coupled Plasma (HDICP) or Plasma Enhanced Chemical Vapor Deposition (PECVD) configuration. Used for advanced processing of wafers or mounted parts. It also has multiple size batch capability. Small footprint at an affordable price.

Applications

    • Etch: Gallium Arsenide, Aluminum Gallium Arsenide, Gallium Nitride, Indium Phosphide, Aluminum, Silicides, Chrome and other materials requiring both corrosive and non-corrosive chemistries.
    • Deposition: Silicon dioxide, Silicon Nitride, Oxynitride, and various other materials.

 

 alt Brochure - Titan Loadlock RIE or PECVD with Vacuum Cassette Elevator

 


 

 

Minilock-Phantom Loadlocked RIE

The Minilock-Phantom III is the first RIE system in the industry to incorporate a vacuum load-lock on a compact platform. The system has been designed to meet all the safety and equipment needs for the most challenging process including etch applications that require corrosive chemistries.

 

Because metal and compound semiconductor etch processes use corrosive chemistries and are often sensitive to atmospheric moisture, consistent results as well as safety depend upon isolating the reaction chamber from the atmosphere. In addition, when operating at lower pressure, maintaining reproducible results from run to run is impacted when the chamber is exposed to Minilock- Phantom III solves these and other issues with its fully integrated loadlocked delivery system.

Applications

Compound Semicoductor, Failure Analysis, Research & Development, Pilot Line.

 

alt Brochure - Minilock-Phantom Loadlocked RIE

 


 

 

Minilock-Orion Loadlocked PECVD

The Minilock-Orion III is a PECVD system with a vacuum loadlock that produces production-quality films on a compact platform. The unique reactor design produces low stress films with excellent step coverage at extremely low power levels. The system meets all safety, facility and process requirements within the laboratory and pilot line production environments. The Minilock-Orion III has many standard features not typically found on a system so reasonably priced, which is why many users world wide have made it their PECVD system of choice.

Applications

MEMS, Solid State Lighting, Failure Analysis, Research & Development, Pilot Line.

 

alt Brochure - Minilock-Orion Loadlocked PECVD

 


 

 

  • Multiple Process Modules:

Gemini Multi-Chamber Stripper

The Gemini is the most compact, inexpensive and versatile system and is designed specifically for the demands of today's production fabs. Its features are the following:

    • Etch rates up to 6um/min
    • High throughput
    • Low plasma damage
    • Self-tuning
    • 100mm to 300mm wafers
    • Small footprint
    • Competitively priced

Applications

MEMS, Compound Semiconductor, Advanced Packaging.

 

alt Brochure - Gemini Multi-Chamber Stripper

 


 

Oracle Loadlocked RIE/PECVD with Vacuum Cassette Elevator

The Oracle III is the smallest and most flexible full production cluster system on the market. The system consists of a central vacuum transport (CVT), vacuum cassette elevators and up to four process reactors. These process reactors are docked to the central load-lock and run in production-mode or can be operated independently. The Oracle III can also be configured for either the laboratory environment (with single wafer loading) or for full production (with vacuum cassette elevators).

 

Because the Oracle III accommodates up to four separate process chambers, there are many possible process combinations, including RIE/ICP etch and PECVD. Processes are safely run without atmospheric contamination since all chambers are vacuum load-locked.

Applications

Compound Semiconductor, Photonics, Research & Development, Pilot Line, Production.

 

 alt Brochure - Oracle Loadlocked RIE/PECVD with Vacuum Cassette Elevator

 


 

 

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